Partial list of Applications Our Customers Are Using the GigaProbes(tm) for Interconnect Development
Partial List of Companies That Have Purchased GigaProbes(tm)
Net Insight AB
Oracle (Sun Microsystems)
Gregorio Larosa Consulting
Université de la Méditerranée - CNRS
AMCC (Applied Micro Circuits Corp.)
Toshiba America Electronic Components
Comtech EF Data
(AMD) Advanced Micro Devices
Lockheed Martin Space Systems Company
Centre de Physique des Particules de Marseille
LSI Logic (5 locations)
Phillips Semiconductor (France)
Seagate Technologies (5 locations)
FormFactor, Inc. (3 locations)
Sierra Video Systems
AJA Video Systems, INC
Partial List of Applications Our Customer Are Using the GigaProbes(tm)
ATE Test Head Bandwidth development and verification
USB 3 COMPLIANCE TESTING
PCI EXPRESS GEN 2
SATA/SAS MIDPLANE INTERCONNECT COMPLIANCE TESTING (ONLY PROBE CAN MAKE DIFFERENTIAL EVEN MODE TEST)
CPU backplane development
6.25G/bit Device Test board and back plane interconnect analysis.
Back plane to daughter board interconnect analysis using Tektronix DSA8200 and IConnect at Cisco
Impedance and S-parameter testing of filter networks used for communication systems. Probes used with Tektronix TDS8200 and IConnect software.
Test 50 and 100 ohm Impedance lines on bump side of CPU package. Improves productivity by 10x over current testing methods.
Xbox PCB impedance analysis
Senor Impdance Analysis using TDR or Impedacne Analyzer
High speed G/bit serial interconnect designs. Differential impedance and S-parameters using a Tektronix TDR and IConnect.
Device evaluation test boards. Measure TDR impedance and S11 s-parameters from Socket to SMA connector using Tektronix CSA8200 TDR and IConnect SI software
CPU Controller board development
IC evaluation board development
Ethernet Network backplane Impedance testing
Commercial CPU backplane/ daughter board development
Package and IC socket Analysis
RAID backplane Impedance testing using Tektronix TDS8200 and IConnect
Disk drive controller development
Military communication equipment development
PCIXII GigaBit development
Verifying PCB manufacture is meeting impedance specifications
Daughter card to backplane impedance analysis and spice modeling
Gigabit Switch Backplane development
Field Service of probe card interconnect at Form Factor with their Tektronix DSA8200/80E01 50Ghz TDR system. The GigaProbes(tm) are connected directly to the 80E01 TDR sampling module making it easy to probe and troubleshoot the probe card interface to find opens/shorts.
Validating impedance of test cards interconnects. Differential and Single ended GigaProbes(tm) give them greater impedance test options.
Impedance testing of device development test boards
Impedance tests of high speed memory boards to include creating IConnect(r) models and S - parameters of test boards. Self C calculation are also modeled on sockets.
Gbit Serial interconnect system design. to measure differential TDR and S-parameters to validate channel bandwidth.
PCB manufacture to verify PCB impedance. Used the Gigaprobes micro manipulator (GPMMA) adapter to probe 12Ghz boards to verify impedance specifications.